Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate
2009-09-11
2011-12-27
Parekh, Nitin (Department: 2811)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
C438S112000, C438S127000, C257SE21504
Reexamination Certificate
active
08084301
ABSTRACT:
Provided is a circuit device manufacturing method for coating a bottom surface of a circuit board with a thin coating of sealing resin. In the present invention, a circuit board having a circuit element such as a semiconductor element embedded therein is placed in a molding die, and a resin sheet containing a thermosetting resin is interposed between the circuit board and a bottom surface of an inner wall of the molding die. Under this condition, the molding die is heated to about 180° C., and a sealing resin in liquid form is injected through a gate. Thereby, the bottom surface of the circuit board can be coated with a thin coating of the sealing resin made of the molten resin sheet.
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Kanakubo Masaru
Mino Katsuyoshi
Motegi Masami
Morrison & Foerster / LLP
Parekh Nitin
SANYO Electric Co., Ltd.
SANYO Semiconductor Co., Ltd.
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