Resin sealing type semiconductor device in which a very small se

Details Resin sealing type semiconductor device in which a very small se Resin sealing type semiconductor device in which a very small se

1991-12-06

1993-03-23

Picard, Leo P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361421, 357 72, 174 524, H05K 502, H01L 2302, H01L 2328, H01L 2348

Patent

active

051969920

ABSTRACT:
A lead of a lead frame cannot be made close to a very small semiconductor chip in view of processing dimensions. If a TAB technique is used to directly connect the semiconductor chip and the lead in order to improve in reliability, a device for forming a bump on an electrode of the chip is required, which increases the cost of investment in equipment. A printed circuit board is formed between the lead and bed and a bonding wire is used to shorten the length of wiring and thus to decrease in cost and improve in reliability. Since an electrode pad of the semiconductor chip, the printed circuit board, and the lead are connected to each other using the TAB techique, the productivity of semiconductor device is increased. Using the TAB technique, no bumps are formed anywhere and the cost of investment in equipment is not so increased.

REFERENCES:
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patent: 4677528 (1987-06-01), Miniet
patent: 4780572 (1988-10-01), Kondo et al.
patent: 4800419 (1989-01-01), Long et al.
patent: 4903114 (1990-02-01), Aoki et al.
patent: 5030796 (1991-07-01), Swanson et al.
patent: 5083189 (1992-01-01), Sawaya
Japanese Patent Abstract, vol. 7, No. 214 (E-199) [3159], Sep. 21, 1983; Japanese Patent Document No. 58-107659, Jun. 27, 1983, Seikoo Keiyou Kogyo K.K.
Japanese Patent Abstract, vol. 10, No. 158 (E-409) [2214], Jun. 6, 1986; Japanese Patent Document No. 61-14731, Jan. 1, 1986, Kansai Nippon Denki K.K.

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