Resin sealing type semiconductor device having outer leads desig

Details Resin sealing type semiconductor device having outer leads desig Resin sealing type semiconductor device having outer leads desig

1990-09-04

1991-07-09

Hille, Rolf

357 70, 357 74, H01L 2348, H01L 2350

Patent

active

050310240

ABSTRACT:
A resin sealing type semiconductor apparatus includes semiconductor devices having electrodes. A plurality of leads include inner leads and outer leads, the former connected to the electrodes of the semiconductor devices by thin metal wires. A sealing resin layer covers at least the semiconductor devices and the inner leads. The outer leads, which are led out in one direction from the sealing resin layer, have two different types or more of pitches, the number of the pitches of each type being two or greater.

REFERENCES:
patent: 4697203 (1987-09-01), Sakai et al.
patent: 4907129 (1990-03-01), Shimizu

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