Resin sealing type semiconductor device having fixed inner leads

Details Resin sealing type semiconductor device having fixed inner leads Resin sealing type semiconductor device having fixed inner leads

1995-05-31

1997-07-08

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257666, 257668, 257672, 257676, 437220, H05K 502, H01L 23495, H01L 23498

Patent

active

056468296

ABSTRACT:
A resin sealing type semiconductor device is arranged such that respective surfaces of plural semiconductor chips, opposite to a circuit forming side, are fixed to both surfaces of a die pad having a smaller area than an area of one surface of each semiconductor chip and to both surfaces of leading end portions of inner leads using an insulating resin having a higher melting point than a heating temperature in a wire bonding process. According to the described arrangement, the deformation of the die pad and the inner lead by the molding process of the resin can be prevented, thereby reducing the production of inferior semiconductor devices in which metal wires or semiconductor chips protrude.

REFERENCES:
patent: 4908933 (1990-03-01), Sagisaka et al.

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