Resin sealing type semiconductor device and method of manufactur

Details Resin sealing type semiconductor device and method of manufactur Resin sealing type semiconductor device and method of manufactur

1998-10-06

2000-09-12

Wilczewski, Mary

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438122, 438123, 438124, H01L 2156, H01L 2158, H01L 2160

Patent

active

061177091

ABSTRACT:
A heat sink with first and second sides are connected to a lead frame. The lead frame has a first group of inner leads having front end portions arranged to make a specific interval with the first side of the heat sink on a horizontal plane and a second group of inner leads having front end portions arranged to make a specific interval with the second side of the heat sink on the horizontal plane. In this stat, the first and second group of the inner leads are connected to a semiconductor chip mounted on the heat sink through several wires. Accordingly, the inner leads and the semiconductor chip can be connected without causing short-circuit between the inner leads and the heat sink.

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patent: 5763296 (1998-06-01), Casati et al.
patent: 5808359 (1998-09-01), Muto et al.
patent: 5852324 (1998-12-01), Poinelli et al.
patent: 5869355 (1999-02-01), Fukaya

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