Resin sealing type semiconductor device

Details Resin sealing type semiconductor device Resin sealing type semiconductor device

1995-11-13

1998-02-17

Fahmy, Wael

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257179, 257796, H01L 2334

Patent

active

057194424

ABSTRACT:
A resin sealing type semiconductor device includes an internal heat radiator having an element placing surface, a semiconductor element bonded to the element placing surface and leads which are separated from the semiconductor element. Wires electrically connect the leads to the electrodes of the semiconductor element. An insulator is located between the internal heat radiator and the leads. A resin package is formed exposing an exposed area of the internal heat radiator. A heat radiating fin is bonded to the exposed area of the internal heat radiator by a solder layer therebetween. The dimension S1 of the exposed area is equal to or larger than the dimension S2 of the bonding area of the heat radiating fin and the solder layer.

REFERENCES:
patent: 3212569 (1965-10-01), McAdam
patent: 3290564 (1966-12-01), Wolff, Jr.
patent: 3965277 (1976-06-01), Guditz et al.
patent: 4151543 (1979-04-01), Hayakawa et al.
patent: 4684975 (1987-08-01), Takiar et al.
patent: 4942497 (1990-07-01), Mine et al.
patent: 5050040 (1991-09-01), Gondusky et al.
patent: 5105259 (1992-04-01), McShane et al.
patent: 5157478 (1992-10-01), Ueda et al.
patent: 5172213 (1992-12-01), Zimmerman
patent: 5198964 (1993-03-01), Ito et al.
patent: 5200809 (1993-04-01), Kwon
patent: 5202288 (1993-04-01), Doering et al.
patent: 5208188 (1993-05-01), Newman
patent: 5227662 (1993-07-01), Ohno et al.
patent: 5229643 (1993-07-01), Ohta et al.
patent: 5252855 (1993-10-01), Ogawa et al.
patent: 5262927 (1993-11-01), Chin et al.
patent: 5328870 (1994-07-01), Marrs
patent: 5367196 (1994-11-01), Mahulikar et al.
patent: 5381042 (1995-01-01), Lerner et al.
patent: 5440169 (1995-08-01), Tomita et al.
patent: 5444025 (1995-08-01), Sono et al.
patent: 5455462 (1995-10-01), Marrs
English Abstract of Japanese Patent Publication No. 59 110127.
English Abstract of Japanese Patent Publication No. 03 082060.
English Abstract of Japanese Patent Publication No. 61 090488.
English Abstract of Japanese Patent Publication No. 02 252273.

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