Resin sealing structure for elements

Details Resin sealing structure for elements Resin sealing structure for elements

1997-09-19

1999-05-04

Kincaid, Kristine

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257778, 257791, H01L 2328

Patent

active

059005815

ABSTRACT:
A resin sealing structure according to the invention has convex parts formed in the vicinities of the perimeters of elements on a substrate to prevent thereby the resin, when it is applied for sealing, from invading the wiring parts of the elements. There may be narrow enough gaps between the substrate and the elements not to allow the resin to enter. This structure enables resin sealing to be accomplished at a high yield and dispenses with metallic caps or the like.

REFERENCES:
patent: 5336931 (1994-08-01), Juskey et al.
patent: 5428188 (1995-06-01), Dozier
patent: 5535101 (1996-07-01), Miles et al.
Paper A380 presented at the Convention of the institute of Electronics, Information and Communication Engineers, 1995.

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