Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2011-01-11
2011-01-11
Chu, Chris (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257SE23051, C257S701000, C257S706000, C257S730000, C438S107000, C438S122000, C361S746000
Reexamination Certificate
active
07868451
ABSTRACT:
A resin sealing semiconductor device (2) having a structure in which a portion to be sealed of components including a plurality of chip mounting board, a semiconductor chip mounted to a front surface of each chip mounting board, and a plurality of leads provided correspondingly to each chip mounting board is embedded in resin molded portions (41and42) molded into a generally plate shape, and outer lead portions of the plurality of leads (16and17) are led out in line from a side surface at one end in a width direction of the resin molded portions, and back surfaces as exposed surfaces (11u1to11w1and12u1to12w1) of each chip mounting board are placed on one surfaces of the resin molded portions (41and42), wherein a plurality of positioning protrusions (50) are provided on one surfaces of the resin molded portions (41and42), and a protrusion height of the positioning protrusions is set so that a gap to be filled with insulating resin is formed between each part of the exposed surface of each chip mounting board and a radiator plate when the positioning protrusions (50) are abutted against the radiator plate.
REFERENCES:
patent: 5440169 (1995-08-01), Tomita et al.
patent: 5559374 (1996-09-01), Ohta et al.
patent: 5646445 (1997-07-01), Masumoto et al.
patent: 5686758 (1997-11-01), Arai et al.
patent: 5747875 (1998-05-01), Oshima
patent: 5796160 (1998-08-01), Kozono
patent: 5920119 (1999-07-01), Tamba et al.
patent: 5942797 (1999-08-01), Terasawa
patent: 5986336 (1999-11-01), Tomita
patent: 6291880 (2001-09-01), Ogawa et al.
patent: 6432750 (2002-08-01), Jeon et al.
patent: 6521983 (2003-02-01), Yoshimatsu et al.
patent: 6700194 (2004-03-01), Nakajima et al.
patent: 6809410 (2004-10-01), Yamada
patent: 7208819 (2007-04-01), Jeun et al.
patent: 7679182 (2010-03-01), Yoshinari et al.
patent: 2003/0006501 (2003-01-01), Waki et al.
patent: 2005/0104168 (2005-05-01), Choi et al.
patent: 2010/0103634 (2010-04-01), Funaya et al.
patent: 6-97323 (1994-04-01), None
patent: 11-220074 (1999-08-01), None
patent: 2002-110867 (2002-04-01), None
International Search Report dated Jul. 4, 2006.
Hara Kazuo
Muramatsu Shuichi
Sato Tomoyuki
Suzuki Hidetoshi
Chu Chris
Kokusan Denki Co. Ltd.
Pearne & Gordon LLP
LandOfFree
Resin sealing semiconductor device and electronic device... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Resin sealing semiconductor device and electronic device..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin sealing semiconductor device and electronic device... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2700392