Resin sealing mold die set with less resin remainder for semicon

Details Resin sealing mold die set with less resin remainder for semicon Resin sealing mold die set with less resin remainder for semicon

1996-11-21

1998-06-16

Nguyen, Khanh P.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

425117, 425544, 425DIG228, 26427217, 26432812, 249135, B29C 4502, B29C 4514, B29C 4527

Patent

active

057666490

ABSTRACT:
There is provided a mold die set for molding a package body which is composed of a lead frame and a semiconductor chip mounted on the lead frame, and the lead frame has a hole. The mold die set is composed of an upper mold die and a lower mold die and the package body being clamped by the upper mold die and the lower mold die. The lower mold die includes a runner section, a table section connected to the runner section and protruding from a bottom of the runner section, a lower concave section connected to the table section, and a lower gate disposed between the table section and the lower concave section. The upper mold die includes a resin reservoir section provided in a position corresponding to the table section such that the hole of the lead frame is positioned between the resin reservoir section and the table section, an upper concave section connected to the resin reservoir section such that the upper concave section and the lower concave section constitute a cavity section for molding the package body, and an upper gate provided between the resin reservoir section and the upper concave section.

REFERENCES:
patent: 4641418 (1987-02-01), Meddles
patent: 5197183 (1993-03-01), Chia et al.
patent: 5635220 (1997-06-01), Izumi et al.

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