Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Female mold type means
Reexamination Certificate
2005-09-14
2008-08-19
Davis, Robert B (Department: 1791)
Plastic article or earthenware shaping or treating: apparatus
Distinct means to feed, support or manipulate preform stock...
Female mold type means
C425S125000, C425S129100
Reexamination Certificate
active
07413425
ABSTRACT:
A resin sealing mold for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a plurality of pistons (42) supporting, at one of their respective ends, lower mold cavities (56) have the other ends thereof slidably inserted in hydraulic cylinder blocks installed on lower mold sets (40).
REFERENCES:
patent: 4372740 (1983-02-01), Kuramochi et al.
patent: 4599062 (1986-07-01), Konishi
patent: 4779835 (1988-10-01), Fukushima et al.
patent: 5158780 (1992-10-01), Schraven et al.
patent: 5326243 (1994-07-01), Fierkens
patent: 5366368 (1994-11-01), Jang
patent: 5435953 (1995-07-01), Osada et al.
patent: 5507633 (1996-04-01), Osada et al.
patent: 5560939 (1996-10-01), Nakagawa et al.
patent: 5989471 (1999-11-01), Lian et al.
patent: 6050802 (2000-04-01), Kobayashi
patent: 6071457 (2000-06-01), Bednarz et al.
patent: 1226340 (1999-08-01), None
patent: 19529352 (1997-02-01), None
patent: 0 339 642 (1989-11-01), None
patent: 54-23705 (1979-08-01), None
patent: 59-055711 (1984-03-01), None
patent: 59-125631 (1984-07-01), None
patent: 60-21225 (1985-02-01), None
patent: 60-97815 (1985-05-01), None
patent: 62-56111 (1987-03-01), None
patent: 63-183824 (1988-07-01), None
patent: 1-127304 (1989-05-01), None
patent: 1-275111 (1989-11-01), None
patent: 2-187041 (1990-07-01), None
patent: 3-292117 (1991-12-01), None
patent: 6-84985 (1994-03-01), None
patent: 6-166046 (1994-06-01), None
patent: 6-182803 (1994-07-01), None
patent: 6-198694 (1994-07-01), None
patent: 6-204379 (1994-07-01), None
patent: 7-4899 (1995-02-01), None
patent: 7-148770 (1995-06-01), None
patent: 7-308934 (1995-11-01), None
patent: 7-314491 (1995-12-01), None
patent: 8-276463 (1996-10-01), None
patent: 9-155912 (1997-06-01), None
patent: 10-75040 (1998-03-01), None
patent: 10-135260 (1998-05-01), None
patent: 10-305439 (1998-11-01), None
patent: 11-16932 (1999-01-01), None
patent: 11-58435 (1999-03-01), None
patent: 11-126787 (1999-05-01), None
patent: 11-233540 (1999-08-01), None
patent: 2000-37746 (2000-02-01), None
patent: 2000-190351 (2000-07-01), None
patent: 2000-326364 (2000-11-01), None
patent: 2000-332035 (2000-11-01), None
patent: 1995-0000512 (1995-01-01), None
Mitsui Yoshihiro
Nishiguchi Masashi
Ogata Kenji
Birch & Stewart Kolasch & Birch, LLP
Dai-Ichi Seiko Co., Ltd.
Davis Robert B
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