Plastic and nonmetallic article shaping or treating: processes – With measuring – testing – or inspecting – Positioning of a mold part to form a cavity or controlling...
Reexamination Certificate
2006-03-07
2006-03-07
Ortiz, Angela (Department: 1732)
Plastic and nonmetallic article shaping or treating: processes
With measuring, testing, or inspecting
Positioning of a mold part to form a cavity or controlling...
C254S272000, C425S121000, C425S125000, C425S149000, C425S163000, C425S171000
Reexamination Certificate
active
07008575
ABSTRACT:
A resin sealing mold for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a plurality of pistons (42) supporting, at one of their respective ends, lower mold cavities (56) have the other ends thereof slidably inserted in hydraulic cylinder blocks installed on lower mold sets (40).
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Mitsui Yoshihiro
Nishiguchi Masashi
Ogata Kenji
Birch & Stewart Kolasch & Birch, LLP
Dai-Ichi Seiko Co., Ltd.
Ortiz Angela
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