Resin sealing mold and resin sealing method

Details Resin sealing mold and resin sealing method Resin sealing mold and resin sealing method

2006-03-07

2006-03-07

Ortiz, Angela (Department: 1732)

Plastic and nonmetallic article shaping or treating: processes

With measuring, testing, or inspecting

Positioning of a mold part to form a cavity or controlling...

C254S272000, C425S121000, C425S125000, C425S149000, C425S163000, C425S171000

Reexamination Certificate

active

07008575

ABSTRACT:
A resin sealing mold for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a plurality of pistons (42) supporting, at one of their respective ends, lower mold cavities (56) have the other ends thereof slidably inserted in hydraulic cylinder blocks installed on lower mold sets (40).

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