Resin sealing method of semiconductor device

Details Resin sealing method of semiconductor device Resin sealing method of semiconductor device

2011-07-26

2011-07-26

Picardat, Kevin M (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S108000, C438S110000, C438S113000, C438S118000, C438S121000, C438S125000, C438S126000, C438S127000, C438S464000, C438S778000, C438S780000

Reexamination Certificate

active

07985629

ABSTRACT:
A resin sealing method of a semiconductor device, is provided with: providing a semiconductor device on which a dummy dump is formed; providing a support body including an adhesive layer provided on a surface of the support body; forming a recess in the adhesive layer; inserting the dummy bump of the semiconductor device into the recess of the adhesive layer; adhering the semiconductor device to the adhesive layer with the semiconductor device positioned on the support body; setting the supporting body having the semiconductor device in a resin sealing mold; supplying a resin into a cavity of the resin sealing mold; sealing the semiconductor device with the resin on the support body while using the dummy bump to inhibit displacement of the semiconductor device caused by a flow of the resin supplied into the cavity of the resin sealing mold; and removing the support body, the adhesive layer, and the dummy bump from the semiconductor device sealed with the resin.

REFERENCES:
patent: 7863745 (2011-01-01), Nomoto et al.
patent: 2004/0097017 (2004-05-01), Shimanuki
patent: 2004/0110319 (2004-06-01), Fukutomi et al.
patent: 2004/0145044 (2004-07-01), Sugaya et al.
patent: 2006/0030075 (2006-02-01), Sugiyama et al.
patent: 2006/0063312 (2006-03-01), Kurita
patent: 4-283987 (1992-10-01), None

Affiliated with

Also associated with

Rating

Resin sealing method of semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin sealing method of semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin sealing method of semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2725897