Resin sealing method for chip-size packages

Details Resin sealing method for chip-size packages Resin sealing method for chip-size packages

1997-07-23

2000-04-11

Ortiz, Angela

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

26427215, 26427217, 425544, B29C 4502, B29C 4514, B29C 7070

Patent

active

060484837

ABSTRACT:
A resin sealing method for a chip size package electrically connected to electrodes of a semiconductor chip in a chip face of the semiconductor chip with one end of leads joined and the other end thereof exposed to an outer face of a sealing resin for sealing the chip face as connection parts to a package substrate, includes the steps of: providing a first transfer mold formed with a cavity recess in which an object to be molded including the semiconductor chip joined to leads is set, and a second transfer mold mated with the first transfer mold; setting the object to be molded in the cavity recess with a transfer mold face containing the cavity recess of the transfer mold; covering the mold face of the first and second mold with release films having flexibility and heat resistance, respectively; clamping the object to be molded with the transfer mold face of the second mold; and filling the cavity of the first mold with a resin for sealing the package with the resin.

REFERENCES:
patent: H1654 (1997-06-01), Rounds
patent: 4347211 (1982-08-01), Bandoh
patent: 5098626 (1992-03-01), Pas
patent: 5800841 (1998-09-01), Miyajima
patent: 5824252 (1998-10-01), Miyajima
patent: 5891384 (1999-04-01), Miyajima

Affiliated with

Also associated with

Rating

Resin sealing method for chip-size packages does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin sealing method for chip-size packages, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin sealing method for chip-size packages will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1174255