Resin-sealing apparatus including a gas spring

Details Resin-sealing apparatus including a gas spring Resin-sealing apparatus including a gas spring

1993-02-11

1995-05-09

Nguyen, Khanh

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Female mold type means

425143, 425144, 425145, 425544, 425588, 425DIG228, 267 6411, 264 401, 26427217, B29C 4502, B29C 4577, B29C 4578

Patent

active

054134714

ABSTRACT:
A gas spring (602) is used as a buffer device in a resin-sealing apparatus for applying a compressive force to a plunger (15). In the gas spring (602), the compressive force at which a compression displacement starts is easily established as required, and the increasing degree of the compressive force with increasing compression displacement is established slowly without difficulty. Any errors in applying resin injection pressures to a plurality of plungers, due to variations in the amount of resin of tablets and in length of plungers, are absorbed in a wide range of the compression displacements thereof so that the resin injection pressures in practice are substantially equalized.

REFERENCES:
patent: 3391425 (1968-07-01), Gardner
patent: 4702463 (1987-10-01), Krauthkramer
patent: 4720367 (1988-01-01), Schenk
patent: 4723899 (1988-02-01), Osada
patent: 4927347 (1990-05-01), Golata et al.
patent: 5007817 (1991-04-01), Wallis
patent: 5158780 (1992-10-01), Schraven et al.

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