Resin-sealed type semiconductor device having an unoccupied seco

Details Resin-sealed type semiconductor device having an unoccupied seco Resin-sealed type semiconductor device having an unoccupied seco

1996-12-18

1998-02-03

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, 257787, H01L 23495

Patent

active

057147990

ABSTRACT:
A resin-sealed type semiconductor device is provided which has a lead array with a plurality of leads arranged at a predetermined interval. A first die pad is provided substantially flush with the lead array. A semiconductor chip is mounted on the first pad and electrically connected to the lead array. A second die pad is arranged in a separate, side-by-side relation to the first die pad. The portion of the lead array, first die pad with the semiconductor chip mounted thereon and second die pad are covered with a resin molding body as an integral unit.

REFERENCES:
patent: 5049977 (1991-09-01), Sako
patent: 5221859 (1993-06-01), Kobayashi et al.

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