Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Reexamination Certificate
2006-04-18
2006-04-18
Zarabian, Amir (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With heat sink embedded in encapsulant
C257S787000, C257S675000, C257S706000, C257S707000, C438S122000, C438S123000, C438S124000, C438S126000
Reexamination Certificate
active
07030505
ABSTRACT:
A resin-sealed type semiconductor device has a mount stage, a semiconductor chip mounted on the stage such that a rear surface of the chip is in contact with the stage, a heat spreader associated with the stage and the chip, and a molded resin package encapsulating the stage, chip, and heat spreader. The stage is configured such that the rear surface of the chip is partially covered with the stage, whereby uncovered areas are defined on the rear surface of the electronic component. The heat spreader is complementarily configured with respect to the stage so as to be in direct contact with the uncovered areas of the rear surface of the electronic component, whereby an entire thickness of both the mount stage and the heat spreader is smaller than a total of a thickness of the mount stage and a thickness of the heat spreader.
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NEC Electronics Corporation
Tran Thanh Y.
Zarabian Amir
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