Resin-sealed type semiconductor device and method for manufactur

Details Resin-sealed type semiconductor device and method for manufactur Resin-sealed type semiconductor device and method for manufactur

1992-09-14

1994-05-24

Hearn, Brain E.

Fishing, trapping, and vermin destroying

437209, 437214, 437215, 437220, H01L 2160

Patent

active

053148428

ABSTRACT:
A resin-sealed type semiconductor device comprises a lead frame having a bed and external leads, a semiconductor element mounted on the bed and having electrodes, a fine metal wire for making an electrical connection between the electrode and the lead frame, a resin layer which seals the semiconductor element, fine metal wire and portion of the lead frame therein and a recess formed at a central portion of one surface side of the resin layer and having a controlled depth, whereby the development of cracks in the resin layer as caused by heat load is prevented.

REFERENCES:
patent: 4483067 (1984-11-01), Parmentier
patent: 4866506 (1989-09-01), Nambu et al.

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