Resin-sealed type semiconductor device

Details Resin-sealed type semiconductor device Resin-sealed type semiconductor device

1975-12-12

1977-01-04

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 72, 357 74, 174 52PE, H01L 2714, H01L 3100, H01L 2328, H01L 2302

Patent

active

040018636

ABSTRACT:
A semiconductor device highly resistant to the normal ambient atmosphere includes a semiconductor element such as a photoconductor element which is fully covered by an adherent layer of a transparent epoxy resin which in turn is coated by a thin layer or film of a transparent chlorinated polypropylene or vinylidene chloride resin. Conductor leads extend from electrodes on the semiconductor element and pass through and are hermetically sealed to the resin layers.

REFERENCES:
patent: 2773158 (1956-12-01), Myers
patent: 2839646 (1958-06-01), Hester
patent: 3742599 (1973-07-01), Desmond et al.
patent: 3764862 (1973-10-01), Jankowski
patent: 3805375 (1974-04-01), Lacombe et al.

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