Resin-sealed type IC device

Details Resin-sealed type IC device Resin-sealed type IC device

1990-04-09

1992-01-21

LaRoche, Eugene R.

357 75, H01L 2328, H01L 2316

Patent

active

050831895

ABSTRACT:
A resin-sealed type integrated circuit device is disclosed which comprises an island constituting a lead frame, and a plurality of hybrid units which, together with the island, are integrally sealed with a resin. The device has the advantages of simplicity of design and reduced size, but without any loss of quality.

REFERENCES:
patent: 3388301 (1988-06-01), James
patent: 3469148 (1969-09-01), Lund
patent: 4074342 (1978-02-01), Honn et al.
patent: 4506238 (1985-03-01), Endoh et al.

Affiliated with

Also associated with

Rating

Resin-sealed type IC device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin-sealed type IC device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin-sealed type IC device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-119149