Resin sealed semiconductor device with improved structural integ

Details Resin sealed semiconductor device with improved structural integ Resin sealed semiconductor device with improved structural integ

1994-01-12

1997-02-25

Loke, Steven H.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Housing or package filled with solid or liquid electrically...

257690, 257693, 257698, 257700, 257702, 257704, 257788, 361709, H01L 2322, H01L 2348, H01L 2304, H01L 23053

Patent

active

056062001

ABSTRACT:
A resin sealed semiconductor device includes a metallic base plate and a covering case adhered to a peripheral section of the metallic base plate. Semiconductor elements are loaded on the metallic base plate, and lead-out terminals extend from an upper surface of a terminal-supporting plate made to adhere to lead-out terminals. The terminal-supporting plate forms an upper surface of the covering case 5 which is filled with a sealing resin. Uneven stripes are molded and extend circumferentially over the entire outer peripheral surface of terminal-supporting plate to roughen the peripheral surface, and the adhesion strength is reinforced by increasing the adhesive area between the terminal-supporting plate and the sealing resin.

REFERENCES:
patent: 5243217 (1993-09-01), Yamada
patent: 5295044 (1994-03-01), Araki et al.

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