Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2000-02-01
2001-07-10
Picardat, Kevin M. (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S124000, C438S126000, C257S675000
Reexamination Certificate
active
06258630
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a semiconductor device, in particular to a resin-sealed semiconductor device in which heat radiation from a package is improved.
2. Description of the Related Art
For high power consumption semiconductor devices which usually generate heat inside during operation, there has been proposed various methods of enhancing capability of radiating heat from a package.
For instance, a semiconductor device, as shown in
FIG. 12
, includes an island
102
on which a semiconductor element
101
is mounted, a lead frame
103
having an inner lead
104
, and a heat spreader
106
. The heat spreader
106
, the island
104
and the lead frame
103
of the semiconductor device are fixed with a low melting point metal plating
105
. In another case, a heat spreader and a lead frame are adhered to each other with an adhesive in Japanese Laid-Open patent application No. 5-36862.
However, such conventional resin-sealed semiconductor devices have their respective problems.
That is, in the above case where the island is fixed to the heat spreader with the low melting point metal plating, the low melting point metal plating is molten at the time of resin injection, so that the fixation is not secure. For that reason, the contact between the heat spreader and the island is sometimes incomplete. The case where the heat spreader and the island are adhered to each other using an adhesive has a drawback of rising in production cost due to expensiveness of the adhesive.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a semiconductor device which is resin-sealed while a part of a lead frame and a heat spreader are in contact with each other without using an adhesive.
A semiconductor device of the present invention includes a semiconductor element; a lead coupled to said semiconductor element; an island on which the semiconductor element is mounted; and a heat spreader being in direct contact with the island, the heat spreader having a suspending portion at its corner in contact with the lead; and a resin sealing the semiconductor element, the lead, the island, and the heat spreader including the suspending portion.
A method of manufacturing a semiconductor device of the present invention, includes:
applying a semiconductor element to the top of an island of a lead frame;
connecting inner leads on the lead frame to bonding pads on the semiconductor element by bonding wires;
putting a heat spreader in a lower mold;
placing the lead frame with the semiconductor element mounted thereto on the heat spreader so that the lead frame is in contact with the heat spreader on the lower mold;
covering the lead frame and the heat spreader on the lower mold with an upper mold;
injecting a resin into an inner space defined by the lower and upper mold while perimeter portions of the lead frame and of the heat spreader is pressed by and held between the upper mold and the lower mold; and
cutting off suspending pins of the heat spreader after the resin is cured.
REFERENCES:
patent: 5365107 (1994-11-01), Kuraishi et al.
patent: 5384286 (1995-01-01), Hirai
patent: 5434105 (1995-07-01), Liou
patent: 5489805 (1996-02-01), Hackitt et al.
patent: 5750423 (1998-05-01), Ishii
patent: 5864174 (1999-01-01), Yamada et al.
patent: 6048754 (2000-04-01), Katayama et al.
patent: 6049971 (2000-04-01), Petit
patent: 5-36862 (1993-02-01), None
NEC Corporation
Picardat Kevin M.
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