Resin-sealed semiconductor device having a particular mold resin

Details Resin-sealed semiconductor device having a particular mold resin Resin-sealed semiconductor device having a particular mold resin

1992-02-03

1993-03-02

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

H01L 2328, H01L 2330

Patent

active

051914034

ABSTRACT:
A resin-sealed semiconductor device and a method for making the same are disclosed. The resin-sealed semiconductor device has a semiconductor chip, with a mold resin structure completely encapsulating and sealing the chip. The mold resin structure has resin upper and lower thicknesses, respectively, above and below the chip. The resin upper thickness is differentiated from the resin lower thickness so that the warp ratio of the resulting mold resin structure is more than 0.0025.

REFERENCES:
patent: 4100566 (1978-07-01), Okikawa et al.

Affiliated with

Also associated with

Rating

Resin-sealed semiconductor device having a particular mold resin does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin-sealed semiconductor device having a particular mold resin, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin-sealed semiconductor device having a particular mold resin will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-130083