Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Patent
1994-01-11
1995-08-29
Larkins, William D.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Housing or package filled with solid or liquid electrically...
257682, 257683, 257702, H01L 2336, H01L 2302, H01L 2312, H01L 3902
Patent
active
054463157
ABSTRACT:
A resin-sealed semiconductor device, including a chip mounting die pad, porous fluorocarbon material located just beneath the die pad, beneath a die-pad supporting layer, gold lead wires, or in a sealing resin surrounding the other components, wherein any water vapor generated by the heat of soldering will be held within the porous fluorocarbon rather than crack the sealant under internal pressure.
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Fukutake Sunao
Hatakeyama Minoru
Hazaki Yoshito
Urakami Akira
Japan Gore-Tex Inc.
Larkins William D.
Martin Wallace Valencia
Samuels Gary A.
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