Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Patent
1992-02-26
1994-01-25
James, Andrew J.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Housing or package filled with solid or liquid electrically...
257682, 257 63, 257702, H01L 2336, H01L 2302, H01L 2312, H01L 3902
Patent
active
052818535
ABSTRACT:
A resin-sealed semiconductor device, including a chip mounting die pad, porous fluorocarbon material located just beneath the die pad, beneath a die-pad supporting layer, gold lead wires, or in a sealing resin surrounding the other components, wherein any water vapor generated by the heat of soldering will be held within the porous fluorocarbon rather than crack the sealant under internal pressure.
REFERENCES:
patent: 3083320 (1963-03-01), Godfrey et al.
patent: 3670091 (1972-06-01), Frantz et al.
patent: 4888634 (1989-12-01), Lai et al.
patent: 4933744 (1990-06-01), Seqawa et al.
patent: 4985751 (1991-01-01), Shiobara et al.
patent: 5015675 (1991-05-01), Walles et al.
patent: 5034801 (1991-07-01), Fischer
patent: 5097317 (1992-03-01), Fujimoto et al.
patent: 5117272 (1992-05-01), Nomura et al.
patent: 5122858 (1992-06-01), Mahulikar et al.
Fukutake Sunao
Hatakeyama Minoru
Hazaki Yoshito
Urakami Akira
James Andrew J.
Japan Gore-Tex Inc.
Samuels Gary A.
Wallace Valencia M.
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