Resin-sealed semiconductor device

Details Resin-sealed semiconductor device Resin-sealed semiconductor device

1992-02-27

1994-12-13

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257778, 257787, H01L 2328

Patent

active

053731905

ABSTRACT:
A resin-sealed semiconductor device includes and has a size that is substantially the same as a semiconductor element. The semiconductor device is easily handled and highly reliable. First ends of terminals made of a conductor, such as copper or the like, are respectively electrically connected to corresponding electrodes of the semiconductor element. The semiconductor element is sealed with a sealing resin so that second ends of the terminals are exposed at the surface of the sealing resin. Since the terminals are strong and are not easily damaged, there are no voids and a highly reliable semiconductor device is achieved.

REFERENCES:
patent: 3922712 (1975-11-01), Stryker
patent: 3959874 (1976-06-01), Coucoulas
patent: 3972062 (1976-07-01), Hopp
patent: 4839713 (1989-06-01), Teraoka et al.
patent: 5019673 (1991-05-01), Juskey et al.

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