Resin-sealed semiconductor device

Details Resin-sealed semiconductor device Resin-sealed semiconductor device

1979-04-17

1981-02-03

Lesmes, George F.

Stock material or miscellaneous articles

Sheet including cover or casing

Complete cover or casing

260 28P, 260 28R, 428484, 428413, 357 72, 525484, B32B 2738, B32B 104

Patent

active

042489202

ABSTRACT:
A semiconductor device sealed in a resin composition, wherein the resin composition contains the prescribed percentages of inorganic fillers having extremely small amounts of impurities, epoxy resin having an epoxy equivalent of 250 or less and a softening point of 120.degree. C. or less, hardening agent, hardening promoter and low melting paraffins.

REFERENCES:
patent: 3301795 (1967-01-01), Wooster
patent: 3639657 (1972-02-01), Moran et al.
patent: 3813379 (1974-05-01), Brouwers et al.
patent: 3838094 (1974-09-01), Sporck
patent: 3849187 (1974-11-01), Fetscher et al.
patent: 4042550 (1977-08-01), Tuller et al.
patent: 4042955 (1977-08-01), Imai et al.
patent: 4092487 (1978-05-01), Imai et al.
patent: 4104698 (1978-08-01), Muratas et al.

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