Resin-sealed semiconductor device

Details Resin-sealed semiconductor device Resin-sealed semiconductor device

2006-03-07

2006-03-07

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S676000

Reexamination Certificate

active

07009304

ABSTRACT:
A resin-sealed semiconductor device has a first semiconductor chip whose circuit surface is bonded to a surface of a die pad. The back surface of a second semiconductor chip is bonded to the back surface of the first semiconductor chip. Each of the semiconductor chips is connected by wire to outer lead respectively. A sealing resin is provided for encapsulating the die pad, the first and second semiconductor chips and the wires so that the other surface of the die pad is exposed.

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