Resin-sealed semiconductor device

Details Resin-sealed semiconductor device Resin-sealed semiconductor device

1995-07-14

1998-01-06

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361736, 257675, 257676, 357 72, 357 70, 174 522, 427211, 428 76, H05K 100

Patent

active

057061750

ABSTRACT:
A resin-sealed semiconductor device includes a plurality of electronic components mounted on a printed wiring board, a circuit mounting surface of the board being resin-sealed, with connection terminals of the electronic components electrically connected to a printed wiring on the board. A surface portion of the board is coated with insulator material which contains tiny hollow spheres and constitutes a thermal expansion resin.

REFERENCES:
patent: 4719502 (1988-01-01), Ikeya et al.
patent: 4814943 (1989-03-01), Okuaki
patent: 5093712 (1992-03-01), Matsunaga et al.
patent: 5124192 (1992-06-01), Kin et al.
patent: 5314842 (1994-05-01), Sawaya et al.

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