Resin-sealed semiconductor device

Details Resin-sealed semiconductor device Resin-sealed semiconductor device

1996-02-26

1998-05-26

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

257685, 257686, H01L 2348, H01L 2352, H01L 2940

Patent

active

057570809

ABSTRACT:
The resin-sealed semiconductor device of this invention includes: a first semiconductor chip having a plurality of terminals, a first surface on which the plurality of terminals are formed, and a second surface opposite to the first surface; a second semiconductor chip having a plurality of terminals, a first surface on which the plurality of terminals are formed, and a second surface opposite to the first surface; a third semiconductor chip having a plurality of terminals, a first surface on which the plurality of terminals are formed, and a second surface opposite to the first surface; and a lead frame having a plurality of leads connected with at least one of the plurality of terminals of the first semiconductor chip, at least one of the plurality of terminals of the second semiconductor chip, and at least one of the plurality of terminals of the third semiconductor chip, wherein the first semiconductor chip and the second semiconductor chip are disposed so that the first surface of the first semiconductor chip and the first surface of the second semiconductor chip face each other, and the second surface of the first semiconductor chip is bonded with the second surface of the third semiconductor chip.

REFERENCES:
patent: 4541003 (1985-09-01), Otsuka et al.
patent: 5331235 (1994-07-01), Chun
patent: 5530292 (1996-06-01), Waki et al.

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