Resin sealed semiconductor device

Details Resin sealed semiconductor device Resin sealed semiconductor device

1977-07-26

1978-08-15

Wojciechowicz, Edward J.

357 68, 357 81, H01L 2328

Patent

active

041077270

ABSTRACT:
A semiconductor device is disclosed wherein a semiconductor pellet is attached on a heat sink of a flange, leads are connected to corresponding electrodes of the semiconductor pellet directly or through wires, the semiconductor pellet and portions of the leads are sealed by resin mold on the flange and top outer periphery of the heat sink is formed with a projection to prevent peel-off of the resin mold and cracking of the resin mold which would otherwise occur due to difference between coefficients of thermal expansion of the flange and the resin mold.

REFERENCES:
patent: 3475662 (1969-10-01), Zido
patent: 3513362 (1970-05-01), Yamamoto

Affiliated with

Also associated with

Rating

Resin sealed semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin sealed semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin sealed semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1440101