Resin-sealed semiconductor device

Details Resin-sealed semiconductor device Resin-sealed semiconductor device

1990-11-13

1992-03-03

James, Andrew J.

357 74, 357 73, H01L 2328, H01L 2312

Patent

active

050937120

ABSTRACT:
A semiconductor device sealed with resin is disclosed. This semiconductor device comprises a semiconductor element, a lead, and a wire electrically connecting said semiconductor element and said lead. The semiconductor element, the wire, and a portion of the lead are sealed with sealing resin. Calcium hydroxide is added into the sealing resin to serve as a corrosion inhibitor. In the semiconductor device sealed with resin, corrosion of the copper wire can thus be suppressed in high temperature environments.

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patent: 4876298 (1989-10-01), Itoh et al.
patent: 4902732 (1990-02-01), Itoh et al.
patent: 4965657 (1990-10-01), Ogata et al.
patent: 5008350 (1991-04-01), Saito et al.

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