Resin sealed semiconductor device

Details Resin sealed semiconductor device Resin sealed semiconductor device

1988-08-02

1990-07-17

Davie, James W.

357 72, H01L 2348

Patent

active

049424548

ABSTRACT:
A resin-sealed semiconductor device comprises a die pad which has through holes. Thin metal films are provided on the surfaces of the die pad except for the wall surfaces of the holes. A resin, which is used for integral molding of the die pad and a semiconductor element, flows into the holes during molding. The semiconductor device so mounted does not induce cracks in the resin and, thus, has good moisture resistance.

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