Resin-seal apparatus for semiconductor element

Details Resin-seal apparatus for semiconductor element Resin-seal apparatus for semiconductor element

1991-07-25

1993-10-12

Nguyen, Khanh P.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

249 68, 264272170, 425121, 425444, 425556, 425547, B29C 4502, B29C 4514, B29C 4540, B29C 4573

Patent

active

052520510

ABSTRACT:
According to this invention, there is disclosed a resin-seal apparatus for a semiconductor element, including cavity blocks arranged to be opposite to each other and having a semiconductor element to be molded, ejector plates arranged to correspond to the cavity blocks, respectively, ejector pins and support pins arranged between the ejector plates and the cavity blocks, a pair of first annular heat-plate molding die sets arranged to surround the ejector plates arranged to correspond to the cavity blocks, a second heat-plate molding die set arranged below a corresponding one of the ejector plates, a plate holder below the second heat-plate molding die set, a gap portion and an elastic member formed between the plate holder and the second heat-plate molding die set, vertically movable connecting rods arranged through the gap portion and each having one end connected to a side surface of the corresponding one of the ejector plates, a stepped bolt engaged with the other end of each of the connecting rods, and push-up rods for pushing up the stepped bolts.

REFERENCES:
patent: 1948989 (1934-02-01), McEwan
patent: 4615857 (1986-10-01), Baird
patent: 4632653 (1986-12-01), Plocher
patent: 4897030 (1990-01-01), Vajtay
patent: 5059105 (1991-10-01), Baird
patent: 5073099 (1991-12-01), Kayano

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