Resin resolution composition, polyimide resin, and...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From carboxylic acid or derivative thereof

Reexamination Certificate

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Details

C528S310000, C528S322000, C528S026000, C528S027000

Reexamination Certificate

active

08034893

ABSTRACT:
A resin solution composition comprising (A) a polyamic acid resin, (B) an alkoxysilyl-containing polyamic acid resin, and (C) an organic solvent cures into a product that has good substrate adhesion and heat resistance and is effective in forming a protective film on a semiconductor device prior to encapsulation with epoxy resin molding material (molding compound) in that it overcomes the chip cracking and thermal deterioration problems of semiconductor packages by thermal stress.

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Goda et al Polymer materials . . . Eng. Materials, vol. 51, p. 44-47 (203).
Newlong Seimitsu Kogyo “News and Topics” webpage.
2005 PWB Expo technology publication, 2005.
Goda et al. Polymer materials.changing through nanotechnology. Polyimide-silica hybrid film.. Eng. Materials, vol. 51, p. 44-47 (2003).
Newlong Seimitsu Kogyo “News and Topics” webpage, 2005.

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