Resin, process for preparing the same and compositon comprising

Details Resin, process for preparing the same and compositon comprising Resin, process for preparing the same and compositon comprising

1994-08-02

1995-07-11

Marquis, Melvyn I.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525117, 525122, 525523, 525534, 528 96, 528 97, C08F 800, C08L 6104

Patent

active

054322340

ABSTRACT:
A novel hydroxyphenylated resin having excellent thermal stability, weather resistance, and electrical properties useful as a resin for a printed circuit board, a resin for sealing a semiconductor, an insulating materials, and the like; a process for preparing the resin; and curable epoxy composition comprising the same. Specifically, the present invention provides a novel resin containing a number of phenolic hydroxyl groups and having a high softening point and substantially no double bonds; and a process for preparing the same wherein a butadiene oligomer and a phenol compound are used as starting materials; and a curable epoxy resin composition comprising the same suitable for applications such as a sealing material.

REFERENCES:
patent: 3057614 (1962-10-01), Greenlee
patent: 3258450 (1966-06-01), Aronoff et al.

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