Resin plating method with added heat-treating process

Details Resin plating method with added heat-treating process Resin plating method with added heat-treating process

2005-05-11

2009-12-01

Meeks, Timothy H (Department: 1792)

Coating processes

With pretreatment of the base

Heating or drying pretreatment

Reexamination Certificate

active

07625606

ABSTRACT:
A resin plating method for a resin molding is disclosed which involves a simple process as an additional process in resin plating to suppress the occurrence of such an undesirable phenomenon as a metal plating film peeling together with a thin resin film due to floating of a thin surface film of the resin molding. A specific portion of the resin molding which portion is apt to undergo peeling of a thin surface resin film is heat-treated at a high temperature and thereafter resin plating is performed.

REFERENCES:
patent: 4940608 (1990-07-01), Kawagishi et al.
patent: 0125675 (1989-10-01), None
patent: 7-118416 (1995-05-01), None
patent: 2004-300566 (2004-10-01), None

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