Resin particle, conductive particle and anisotropic...

Stock material or miscellaneous articles – Coated or structually defined flake – particle – cell – strand,... – Particulate matter

Reexamination Certificate

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C428S404000, C428S405000, C428S406000, C428S407000

Reexamination Certificate

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10517076

ABSTRACT:
Resin particles comprised of an acrylic resin. Not only is the maximum compression deformation ratio thereof as great as 60% or more but also the load required for 60% compression deformation is as small as 60 mN or less. Wiring boards are therefore coupled in using an anisotropic conductive adhesive obtained by first manufacturing conductive particles having a conductive coating formed on a resin particle surface of the resin particles by adhering a conductive material to the surface of the above resin particles as a core. On dispersing the conductive particles in an adhesive material, the conductive particles sandwiched between metallic wires of the wiring boards are greatly deformed by a small load, so that the electrical devices having a high conduction reliability can be obtained.

REFERENCES:
patent: 06-001854 (1994-01-01), None
patent: 08-113654 (1996-05-01), None
patent: 09-185069 (1997-07-01), None
patent: 10-259253 (1998-09-01), None
patent: 11-073817 (1999-03-01), None
patent: 2000-053710 (2000-02-01), None
patent: 2000-319309 (2000-11-01), None

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