Resin-packaged electronic component having bent lead terminals

Details Resin-packaged electronic component having bent lead terminals Resin-packaged electronic component having bent lead terminals

1994-09-09

1995-09-19

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

361743, H01L 2302

Patent

active

054517168

ABSTRACT:
An electronic component is provided which comprises a resin package for enclosing inside parts, and at least one lead terminal projecting out from the resin package to have a bonding end. The lead terminal is bent to provide an armpit-like portion between the lead terminal and the resin package for retaining a solder wire in a sandwiched state. At the time of mounting the electronic component to a circuit board, the solder wire be caused to melt at a soldering temperature for merging with solder fillets along the bonding end of the lead terminal.

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patent: 5107324 (1992-04-01), Iwahara et al.
patent: 5273081 (1993-12-01), Maksim

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