Resin-packaged electronic component

Details Resin-packaged electronic component Resin-packaged electronic component

1994-08-23

1995-11-14

Kincaid, Kristine L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

3613013, H01L 2328

Patent

active

054668875

ABSTRACT:
A resin-packaged electronic component is provided which comprises an electronic element enclosed in a thermosetting resin package having a mounting face. The resin package is provided with at least one stress concentrating portion extending substantially in parallel to the mounting face and contained in an imaginary plane extending between the electronic element and the mounting face.

REFERENCES:
patent: 4682270 (1987-07-01), Whitehead
patent: 4920404 (1990-04-01), Shrimali et al.
patent: 5095360 (1992-03-01), Kizaki et al.
patent: 5107073 (1992-04-01), Steffen
patent: 5229642 (1993-07-01), Hara et al.
patent: 5309026 (1994-05-01), Matsumoto
patent: 5313102 (1994-05-01), Lim et al.
patent: 5315155 (1994-05-01), O'Donnelly et al.

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