Resin mounting structure for an integrated circuit

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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Details

174 685, 361403, 361406, 361411, 368155, 368159, H05K 118

Patent

active

046444459

ABSTRACT:
This invention describes an improved resin mounting structure for use with an integrated circuit. An integrated circuit chip is affixed to a circuit substrate which has a hole. Circuit patterns connect to the contact pads of the integrated circuit chip and are added along the circuit substrate. An epoxy resin material is gated through the hole to surround and enclose the integrated circuit chip. In this invention, circuit patterns which are added beneath the integrated circuit chip are positioned over the hole in the substrate to allow an unimpeded flow of resin material. In addition, conductive spacing pegs are provided at each integrated circuit contact pad to allow for a uniform spacing between the integrated circuit and the circuit substrate and to provide for a more electrically and mechanically secure connection between the IC chip and the circuit substrate. Also, the circuit substrate is formed from a flexible material to absorb the displacement caused by differential thermal expansion.

REFERENCES:
patent: 4048438 (1977-09-01), Zimmerman
patent: 4065850 (1978-01-01), Burr et al.
patent: 4143456 (1979-03-01), Indue
patent: 4396936 (1983-08-01), McIver
patent: 4432131 (1984-02-01), Sadamasa et al.
patent: 4435740 (1984-03-01), Huckabee et al.
patent: 4573105 (1986-02-01), Beldavs

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