Plastic and nonmetallic article shaping or treating: processes – Direct application of fluid pressure differential to... – Producing multilayer work or article
Patent
1998-05-01
2000-06-27
Ortiz, Angela
Plastic and nonmetallic article shaping or treating: processes
Direct application of fluid pressure differential to...
Producing multilayer work or article
26427217, 264276, 2643284, 264316, 425116, 425544, B29C 4502, B29C 7070
Patent
active
060803541
ABSTRACT:
A resin molding method by which resin is filled into a cavity while an article to be molded is clamped between upper and lower molding dies, wherein a cavity indentation is formed from an end face of a cavity piece provided in a cavity hole formed in the molding piece and of an internal wall surface of the cavity hole, the method including the steps of: arranging the cavity piece provided in the lower molding die so as to be movable in a direction in which the molding dies are opened or closed; covering a parting surface of each of the resin molding dies with a release film; sucking the release film from an area in the vicinity of an inner bottom surface of the cavity indentation of the lower molding die, to thus form a storage section for storing resin used for a molding operation within the cavity hole; feeding a required amount of resin to the storage section; setting the article on the lower molding die and clamping the article between the resin molding dies; and pressing the cavity piece of the lower molding die to a resin molding position to thus cause the resin provided in the cavity to set, thereby molding the article with resin.
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Semiconductor Packing Update, The Industry's First Newsletter Devoted to Semiconductor Packaging; 1994 vol. 9, No. 6, Editior and Publisher: Dr. Subashi Khadpe.
APIC Yamada Corporation
Ortiz Angela
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