Resin molding equipment and resin molding method

Details Resin molding equipment and resin molding method Resin molding equipment and resin molding method

2005-11-01

2008-08-05

Davis, Robert B (Department: 1791)

Plastic and nonmetallic article shaping or treating: processes

With measuring, testing, or inspecting

C264S272150, C264S272170, C425S089000, C425S126100, C425S141000, C425S182000, C425S449000

Reexamination Certificate

active

07407608

ABSTRACT:
The resin molding equipment comprises: a work piece feeding section; a work piece measuring section measuring thickness of a semiconductor chip mounted on a work piece; a resin supplying section supplying liquid resin to the work piece; a resin molding section having a molding die for molding the work piece with the liquid resin; a product measuring section measuring thickness of a resin molded part of the molded product; a product accommodating section; and a control section for controlling the sections. The control section includes means for adjusting an amount of the liquid resin, which is supplied to the work piece by the resin supplying section, on the basis of the thickness measured by the work piece measuring section.

REFERENCES:
patent: 4257840 (1981-03-01), Fujii
patent: 4973239 (1990-11-01), Herrmann et al.
patent: 5200202 (1993-04-01), Ahn
patent: 6224936 (2001-05-01), Gochnour et al.
patent: 6988879 (2006-01-01), Ho et al.
patent: 7175405 (2007-02-01), Kobayashi et al.
patent: 2002/0015748 (2002-02-01), Miyajima et al.
patent: 01235616 (1989-09-01), None
patent: 11330114 (1999-11-01), None
patent: 2000277551 (2000-10-01), None
patent: 2003-165133 (2003-06-01), None
patent: 2005183787 (2005-07-01), None
Partial machine translation of JP 2003-165133 A obtained from the JPO website. The date of the reference is Jun. 10, 2003.

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