Resin molding die and production method for semiconductor...

Details Resin molding die and production method for semiconductor... Resin molding die and production method for semiconductor...

2007-02-20

2007-02-20

Davis, Robert B. (Department: 1722)

Static molds

Including static filling means in contact with mold cavity

C249S141000, C249S160000, C425S116000, C425S129100, C425S812000

Reexamination Certificate

active

10659261

ABSTRACT:
A resin molding die includes: a cavity; a resin inlet through which a liquid resin to be cured is injected into the cavity; and an air vent through which air is released to an exterior space of the resin molding die during injection of the resin, the air vent being provided on an opposite side from the resin inlet with respect to the cavity.

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U.S. Appl. No. 09/799,360 filed Mar. 6, 2001.

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