Resin molding apparatus and resin molding method

Details Resin molding apparatus and resin molding method Resin molding apparatus and resin molding method

2011-04-05

2011-04-05

Heitbrink, Jill L (Department: 1743)

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

Shaping against forming surface

C425S111000

Reexamination Certificate

active

07919035

ABSTRACT:
Disclosed is a resin molding apparatus capable of enhancing transfer accuracy, reducing the cost of a molding apparatus, and shortening a molding cycle. The resin molding apparatus includes a first mold; a second mold disposed in opposition to the first mold; a transfer plate (34) attached to one of the first and second molds and comprising a transfer surface bearing a pattern of pits and projections and oriented toward a cavity (C1, C2); and a thermal insulation layer (40) disposed between the transfer plate (34) and the one of the first and second molds and formed through growth from the transfer plate (34) side or from the one of the first and second mold sides. Being disposed between the transfer plate (34) and the one of the first and second molds, the thermal insulation layer (40) can restrain dissipation of thermal energy of a molding material toward the mold. This can restrain formation of a skin layer, which would otherwise result from a sharp drop in temperature of the molding material, whereby transfer accuracy can be enhanced.

REFERENCES:
patent: 5489410 (1996-02-01), Baumgartner et al.
patent: 6030556 (2000-02-01), DePuydt et al.
patent: 6093013 (2000-07-01), Sagrati et al.
patent: 6846445 (2005-01-01), Kim et al.
patent: 2005/0138803 (2005-06-01), Okawa et al.
patent: 1640132 (2006-03-01), None
patent: 08269648 (1996-10-01), None
patent: 10-149587 (1998-06-01), None
patent: 11034112 (1999-02-01), None
patent: 2000322780 (2000-11-01), None
patent: 2001-526126 (2001-12-01), None
patent: 2002-361689 (2002-12-01), None
patent: 2006-8759 (2006-01-01), None
patent: 9737348 (1997-10-01), None
patent: 9932269 (1999-07-01), None
patent: 03070444 (2003-08-01), None
patent: 2006043708 (2006-04-01), None
Electronic translation of Japanese Reference 10-149587.
Supplementary European Search Report, Application No. EP 07 74 2087, Date of Completion of the Search: Feb. 5, 2010, pp. 1-2.

Affiliated with

Also associated with

Rating

Resin molding apparatus and resin molding method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin molding apparatus and resin molding method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin molding apparatus and resin molding method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2723310