Resin molding apparatus

Details Resin molding apparatus Resin molding apparatus

1990-12-27

1992-09-29

Chiesa, Richard L.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

264134, 26427217, 2643289, 425 90, 4251291, 425543, 425547, B29C 4514

Patent

active

051512769

ABSTRACT:
A resin molding apparatus for molding an insulating resin mold at the peripheral portion of a semiconductor wafer has an upper metallic mold, and a lower metallic mold which clamps the semiconductor wafer with the upper metallic mold. The upper and lower metallic molds form a resin space at the portion corresponding to the peripheral portion of the semiconductor wafer. The contact surfaces of the upper and lower metallic molds, which are in contact with the semiconductor wafer, and the inner surface of the resin space are coated with elastic material which does not adhere to the insulating resin.

REFERENCES:
patent: 3641254 (1972-02-01), Bunting et al.
patent: 3659821 (1972-05-01), Sakamoto et al.
patent: 4618322 (1986-10-01), Lagasse
patent: 4881885 (1989-11-01), Kovac et al.

Affiliated with

Also associated with

Rating

Resin molding apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin molding apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin molding apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1967156