Resin molding apparatus

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds

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Details

425121, 425183, 425190, 425544, 425588, 425DIG228, 2491141, 249115, 249135, B29C 4502

Patent

active

058826920

ABSTRACT:
A gate portion constituting a gate of a resin molding die is made of a hard alloy having a hardness greater than the predetermined hardness in the iron-based hard alloy used to from a cavity block and a center block. Opposing surfaces of the cavity block halves include a silicone rubber layer at least at the portions thereof which contact portions of the lead frame in a semiconductor encapsulation molding apparatus.

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patent: 4779835 (1988-10-01), Fukushima et al.
patent: 4872825 (1989-10-01), Ross
patent: 5061164 (1991-10-01), Sabado et al.
patent: 5139407 (1992-08-01), Kim et al.
patent: 5252051 (1993-10-01), Miyamoto et al.
patent: 5336272 (1994-08-01), Tsutsumi et al.
patent: 5468141 (1995-11-01), Iwami et al.

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