Resin-molded type semiconductor device with tape carrier connect

Details Resin-molded type semiconductor device with tape carrier connect Resin-molded type semiconductor device with tape carrier connect

1995-10-05

1997-02-25

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257692, 257672, H01L 23495

Patent

active

056061994

ABSTRACT:
The resin-molded type semiconductor device disclosed has a semiconductor chip mounted on an island of a lead frame. The device includes a plurality of first metal foil leads on a tape carrier, which connect electrode pads respectively to inner leads of the lead frame. Among the first metal foil leads, there are a plurality of second metal foil leads which constitute ground wiring, and these second metal foil leads are connected in parallel to the island. For these connections, each of the second metal foil leads has one branch lead, or two branch leads respectively on the inner lead side and on the outer lead side. By forming the ground wiring in this way, it is possible to reduce the parasitic inductance and resistance of the ground circuit.

REFERENCES:
patent: 4771330 (1988-09-01), Long

Affiliated with

Also associated with

Rating

Resin-molded type semiconductor device with tape carrier connect does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin-molded type semiconductor device with tape carrier connect, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin-molded type semiconductor device with tape carrier connect will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1976050