Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Patent
1995-06-01
1996-09-03
Carroll, J.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
257207, 257637, 257642, 257691, 257739, 257787, H01L 2702, H01L 2934, H01L 2348, H01L 2944
Patent
active
055526390
ABSTRACT:
A resin molded type semiconductor device has a metallic guard ring that is formed to cover the peripheral edge of the surface of a tetragonal semiconductor substrate. In order to prevent a passivation film on the guard ring from being cracked by stresses due to a resin mold package concentrating in the four corners of the semiconductor substrate, slits or rows of small holes are formed in the corner portions of the guard ring.
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IIL-Device, Video-Tape Player and TV Set (Example 2); Y. Nakano et al. pp. 1-11.
Hara Yuji
Ito Satoru
Toya Tatsuro
Carroll J.
Hitachi , Ltd.
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