Resin molded type semiconductor device having a conductor film

Details Resin molded type semiconductor device having a conductor film Resin molded type semiconductor device having a conductor film

1985-06-13

1986-11-25

Carroll, J.

357 40, 357 52, 357 53, 357 65, 357 72, H01L 2348, H01L 2702, H01L 2934, H01L 2940

Patent

active

046252274

ABSTRACT:
A resin molded type semiconductor device has a metallic guard ring that is formed to cover the peripheral edge of the surface of a tetragonal semiconductor substrate. In order to prevent a passivation film on the guard ring from being cracked by stresses due to a resin mold package concentrating in the four corners of the semiconductor substrate, slits or rows of small holes are formed in the corner portions of the guard ring.

REFERENCES:
patent: 3906539 (1975-09-01), Sauermann et al.
patent: 4453174 (1984-06-01), Kawasaki et al.

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