Resin molded type semiconductor device having a conductor film

Details Resin molded type semiconductor device having a conductor film Resin molded type semiconductor device having a conductor film

1994-08-22

1995-11-21

Carroll, D. J.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257787, 257739, 257691, 257642, 257207, H01L 2934, H01L 2940, H01L 2702, H01L 2348

Patent

active

054689988

ABSTRACT:
A resin molded type semiconductor device has a metallic guard ring that is formed to cover the peripheral edge of the surface of a tetragonal semiconductor substrate. In order to prevent a passivation film on the guard ring from being cracked by stresses due to a resin mold package concentrating in the four corners of the semiconductor substrate, slits or rows of small holes are formed in the corner portions of the guard ring.

REFERENCES:
patent: 4248920 (1981-02-01), Yoshizumi et al.
patent: 4271582 (1981-06-01), Shirai et al.
patent: 4412237 (1983-10-01), Matsumura et al.
patent: 4625227 (1986-11-01), Hara et al.
"IIL (I.sup.2 L) Device: Video-type Player and TV Set (Example 2)" Yoshihiro Nakano et al., pp. 47-51 (1978), English translation pp. 1-11.

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